Photopolymerization of Epoxides with a New Catalyst Containing Photodecomposable Organosilane Compound and Electrical Properties of the Epoxy Resins Photocured

Abstract

Epoxy resins were photocured with a new type of photoinitiation catalyst which consists of aluminum complex and (o-nitrobenzyloxy)triphenyl silane and the properties of the epoxy resins photocured were examined. Photocure time of epoxy resin varied by the structure of the aluminum complex and the silyl ether. The catalyst activity was best when using tris (ethyl acetoacetato) aluminum as aluminum complex and tris(4-chlorophenyl) (o-nitrobenzyloxy)silane as silyl ether. The catalyst activity increased with an increase in temperature. The epoxy resins photocured with this catalyst have excellent electrical properties, which have not been observed for epoxy resins cured with any other catalysts. Volume resistivity of epoxy resin cured with this catalyst is 100 times higher than that cured with strong acid type catalyst, such as onium salt of SbF6-. Corrosiveness of epoxy resin photocured with this catalyst was 10³ times lower, compared to in case of strong acid type catalyst.