Abstract
semi-conductor devie assembly process is composed of die-bonding and wire-bonding operatios. This process involves a lot of manual operations using microscopes. Automation of this process involves a lot of manual operations using microscopes. Automation of this process has been desired for cost reduction, quality stabilization etc.
This paper describes the problem and prospects of bonding technique, the fully automated die-bonding machine, and the fully automated wire-bonding machine by introducing the pattern recognition technique which we have newly developed.
