半導体プロセス・デバイスシミュレーションの自作と業務への利用効果

浅井 誠

doi:10.11487/oukan.2007.0.92.0

The Second Conference of Transdisciplinary Federation of Science and Technology

Session ID : 30C02

DOI https://doi.org/10.11487/oukan.2007.0.92.0

Conference information

Host: Transdisciplinary Federation of Science and Technology

III-21 Accelerating Technology Development by Trans-disciplinary Science and Technology I

A new design of semiconductor Process/Device simulation and It's Effects to Production Flow

*Makoto Asai

Author information

Keywords: simulation, process simulation, device simulation, semiconductor production, IC structure of cross section, IC characteristic

CONFERENCE PROCEEDINGS FREE ACCESS

Details

Abstract

A new process & device simulation was designed for semiconductor production process flow.The equations were defined by considering the physical data.Simulation models were defined by help of the actual information on the cross section sturucture of IC and IC characteristic.This technique reduces the time that is spent for experiments and help to detect problems that occured during the process flow.In this way,production effciency is succesfully improved.

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