Abstract
The directed deposition of functional ceramics with semiconductors is of great importance for materials research and future device applications. Progress is reviewed for the chemical-solution deposition of insulating thin films at sufficiently reduced temperatures for device integration. Topics include: design of a materials systems; thermal processing conditions; transformation of metal organic precursors to metal oxides (i.e., ceramic); densification, constrained shrinkage, residual- stress development; compatibility issues; evolution of microstructure and the design of texture; and structure-property relationships in deposited materials. Examples are given for materials with a dielectric function, and include the fabrication of integrated capacitors, ferroelectrics and piezoelectrics. In addition, the ability to mediate the deposition of oxides on semiconductors at predetermined locations and in specific patterns is also of great importance for device integration. Progress to this end, through the use of soft-lithographic methods, and additive patterning techniques, are discussed and reviewed.
