Abstract
A solid, semi-transparent and several micrometer thick Aluminum Nitride film was successfully deposited on a glass substrate under room temperature using Aerosol deposition method. He and N2 gas was used. The maximum thickness was limited by cracking of the film or the substrate. The latter indicates the very good adherence of the film to the substrate. The film and the substrate showed convex surface due to residual compressive stress in the film. Vickers hardness number of the film was about 1100 and was nearly the same as sintered Aluminum Nitride. The energy dispersive X ray analysis showed the content of the film were mostly Aluminum and Nitrogen. Oxygen content slightly increased from the original powder. The X ray diffraction analysis showed that the film had the mixture of Wurtzite and cubic structure, while the original powder had only Wurtzite structure.
