Abstract
Integrating and embedding various passive components like a resistor, a capacitor, and an inductor, in one system module, is one of the attractive way to achieve down-sizing, cost-reduction and higher performance in RF wireless communication products such as a cellular phone, a personal digital assistance (PDA) and so on. Aerosol Deposition (AD) method can offer the module with passive components by incorporating different materials with various electrical properties. In this paper, we present the properties of dielectric AD film deposited in various conditions to obtain high dielectric constant and high Q value in high frequency. The electrical properties of the multi-layered capacitor using AD method on resin FR4 substrate are also presented.
