Tensile Strength of SiO₂ Thin Films using Electrostatic Grip

Abstract

The tensile strength of insulating thin films was measured by a new tensile testing method using an electrostatic grip. Two thin film tensile testers both in the air and in vacuum were realized using this method. These testers are applied for a tensile test of plasma enhanced CVD SiO₂ thin films. The tensile strength and the fracture toughness were measured both in vacuum and in the air, and these results were compared and discussed. Tensile strength was strongly affected by the testing environment, and these effects must be mainly due to water in the air.