Interface structure of transient liquid phase bonded alumina via In/Ag alloy/In interlayers

Takaya Akashi; Sung Hong; Hajime Kiyono; Andreas M. Glaeser

doi:10.14853/pcersj.2005F.0.6.0

18th Fall Meeting of The Ceramic Society of Japan & 1st Asia-Oceania Ceramic Federation (AOCF) Conference

Session ID : 1A17

DOI https://doi.org/10.14853/pcersj.2005F.0.6.0

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Host: The Ceramic Society of Japan

Interface structure of transient liquid phase bonded alumina via In/Ag alloy/In interlayers

*Takaya Akashi, Sung Hong, Hajime Kiyono, Andreas M. Glaeser

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Keywords: transient liquid phase bonding, alumina, silver alloy, indium, interface structure

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

Alumina was joined via In/Ag alloy/In interlayers at 973 and 1073 K for 5.4 to 86.4 ks at 5 MPa by hot pressing. The specimen joined at 973 K for 86.4 ks had higher 4-point bending strength than that joined at 1073 K for 86.4 ks. Titanium in Ag alloy diffused to the Ag alloy/alumina interface after joining at 1073 K for 86.4 ks. TEM observation of the specimen joined at 1073 K for 86.4 ks revealed that thin layer formed at the Ag alloy/alumina interface, and nano pores formed between the thin layer and alumina.

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