Abstract
To prevent the hazard problem in environment, we investigated Pb free solder for electronic ceramic parts. Sn-3Ag-0.5Cu alloys were selected as a general solder alloys, however, this alloy have the problem of electrde leaching for soldering electro ceramic parts. We investigate concentrate metal element at the interface between solder alloy and electrode in lead free solder. As a result, we found that the additives such as transition metal concentrate at the interface, prevent electrode leaching. Cu in Cu6Sn5 intermetallic compound were substitued the additive elements. The stable interface generated by this substitution prevent the electrode leaching.
