Abstract
(K0.47Na0.47Sr0.03)NbO3 system thin films were deposited by PLD on Si crystal substrates. The rf-sputtering layer of RuO2 and SrRuO3 layer formed by PLD were employed as the lower electrodes. (K0.47Na0.47Sr0.03)XNbO3 bulk targets (X=0.9-1.05) with 0.5-5% Mn additive were prepared, and the effects of Mn addition and influences of A/B ratio on the electrical properties of the deposited films were studied. The depositional conditions for the crystalline film formation at lower temperature were also investigated.