Abstract
In recent years, ink-jet(IJ) printing technique is attracted attention as a simple direct wiring and on-demand fabrication method of functional materials for high integration micro electronic devices and micro packaging. In this research, in order to develop a practical IJ wiring technology as material direct writing (MDW), we tried to introduce a laser assistance technique to reduce the expansion of pattern width by wetting properties. By heating a substrate using laser assist, we controlled a spread of a droplet on the several substrates and obtained fine patterning of Ag wire with the width about 10um, high aspect ratio and high throughput over 10mm/sec.
