Preprints of Annual Meeting of The Ceramic Society of Japan
Preprints of Fall Meeting of The Ceramic Society of Japan
Annual Meeting of The Ceramic Society of Japan, 2009
Session ID : 1E32
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Joining of Silicon Nitride by Reaction Bonding
*Naoki KONDOHideki HYUGAHideki KITA
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

Silicon nitride parts were joined with silicon slurry, followed by reaction bonding and post sintering. The joined silicon nitride showed average strength of 404 MPa. The result shows a potential of this joining technique, however, crack formation must be overcome.

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© The Ceramic Society of Japan 2009
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