Abstract
The indentation on film/substrate systems with a point-sharp indenter is simulated with the finite element method. The drop in the indentation load P vs. penetration depth h curve is observed when the film/substrate interface slips. The penetration depth at the drop increases with an increase of the interfacial shear strength, the ratio of film Young's modulus to substrate one, and the apex angle of the indenter, and with a decrease of the yield strength of the film. The shear strength is quantitatively discussed in various conditions.
