Fabrication of TiO2 microstructure by reactive ion etching

Abstract

We demonstrated the high aspect ratio microfabrication process of (001)TiO2 for photoniccrystal structure by SF6-RIE technique. Cr micro patterns as an etching mask material were prepared on a TiO2 single crystal (rutile) by photolithography and radio frequency (RF) sputtering. The TiO2 was anisotropically etched along [001] by optimizing the etching conditions. The higher selectivity etching rate ratio of TiO2/Cr was obtained by lower RF power and higher flow rate of SF6. In addition, higher anisotropic etching with a higher aspect ratio was achieved by higher RF power and high flow rate of SF6.