Proceedings of JSPE Semestrial Meeting
2003 JSPE Spring Meeting
Session ID : F68
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Host: The Japan Society of Precision Engineering

Study of Dressingless CMP using Chemical Treatment for Pad Surface.
*Jaehong Park, Shinichi Haba, Yosikazu Nishida, Masaharu Kinosita
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Keywords: CMP (Chemical Mechanical Planarization), Glazing, Dressing, Swelling, Surface Treatment, Solvent
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[in Japanese]
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© 2003 The Japan Society for Precision Engineering
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