STI-CMP Process with CeO<sub>2</sub> Slurry for 90nm or More Shrinked Devices

Proceedings of JSPE Semestrial Meeting

2003 JSPE Spring Meeting

Session ID : F73

DOI https://doi.org/10.11522/pscjspe.2003S.0.314.0

Conference information

Host: The Japan Society of Precision Engineering

STI-CMP Process with CeO₂ Slurry for 90nm or More Shrinked Devices

*Takashi Watanabe, Toshiyuki Isome, Naoki Idani, Motosyu Miyajima

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Keywords: CMP, Planarization, Cerium Oxide, CeO2, STI, Slurry

CONFERENCE PROCEEDINGS FREE ACCESS

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[in Japanese]

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© 2003 The Japan Society for Precision Engineering

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