Proceedings of JSPE Semestrial Meeting
2003 JSPE Spring Meeting
Session ID : F83
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Host: The Japan Society of Precision Engineering

Profile Modification for a Large-sized Wafer in Polishing (4st Report): Polishing-Head and Pressure Distribution
*Kenichiro Yoshitomi, atsunobu Une, Masaaki Mochida
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Keywords: CMP, Silicon Wafer, FEM, Pressure Distribution, Air-Back System
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[in Japanese]
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© 2003 The Japan Society for Precision Engineering
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