Proceedings of JSPE Semestrial Meeting
2004 JSPE Spring Meeting
Session ID : H25
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Host: The Japan Society of Precision Engineering

Study on Clearing of the Micro Clack Using RIE -Visualization of the Micro Crack Using RIE
*Seiichi Yokomizo, Shinichirou Kubota, Yoshiyuki Uno
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Keywords: reactive ion etching, micro crack, brittle material, polishing
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[in Japanese]
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© 2004 The Japan Society for Precision Engineering
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