Proceedings of JSPE Semestrial Meeting
2004 JSPE Spring Meeting
Session ID : K17
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Host: The Japan Society of Precision Engineering

Numerical Analysis of the Polishing Removal Rate in Polishing results of Aluminum Magnetic Disk Substrate (Continued report)
[in Japanese], *[in Japanese]
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Keywords: Polishing, SiO2 abrasive, Removal rate, Polishing pressure, Polishing speed
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Abstract
[in Japanese]
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© 2004 The Japan Society for Precision Engineering
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