Proceedings of JSPE Semestrial Meeting
2006 JSPE Autumn Meeting
Session ID : G04
Conference information

Host: The Japan Society for Precision Engineering

The newest trend of a semiconductor device and the planarization CMP
*Yohei Yamada, Takahiro Sugaya, Masanori Kawakubo
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (346K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
This paper describes the view of the CMP (chemical-mechanical polishing) technology corresponding to Cu
Content from these authors
© 2006 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top