Abstract
Recently, in order to avoid adhering contamination on the surface of various precision parts such as IC chips, optical lenses and silicon wafers, non–contact chucks have been used to hold these part. In the previous paper a non–contact chuck using ultrasonic vibration was proposed. It was indicated that the proposed chuck could hold a floating object in both vertical and horizontal directions. In this paper, the cause of horizontal holding force was discussed theoretically and experimentally. It was consequently found that the ultrasonic vibration caused negative pressure on the moving plate, which generated the horizontal holding force.
