Proceedings of JSPE Semestrial Meeting
2006 JSPE Spring Meeting
Session ID : D23
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Research on Nanoscratching of Si Wafer
*Hidemitsu OkabeTakashi TsumuraJun ShimizuLibo ZhouHiroshi Eda
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Abstract
This study aims to clarify the interaction between Si wafer and individual diamond abrasives in an atomic level. This paper reports on the results obtained through the nano–scratching simulations by using the molecular dynamics method and the experiments in air and/or vacuum by an atomic force microscope (AFM), respectively. From the simulation results, the formation of amorphous phase around the concave groove was observed. On the contrary, from the experimental results, the formation of embossment on the scratched area was observed under air, while the formation of concave groove was observed under vacuum.
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© 2006 The Japan Society for Precision Engineering
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