Precise Polishing of Silicon Wafer Using Electrolyzed Reduced Water

Abstract

This paper describes precise polishing of silicon wafer using dilute electrolyzed reduced water of the electrolyte salt like NaCl, instead of conventional polishing with slurry which is not environmentally consciousness. First, the polishing ability of electrolyzed reduced water clarified similar to the polishing slurry, and ten times or more greatly than the NaOH solution as results by doing the polishing experiment of silicon wafer. Next, it has been understood that the surface quality on the polishing side with electrolyzed reduced water is excellent from the results of surface analysis and roughness measurement. The electrolyzed reduced water can be applied to polishing the silicon wafer instead the polishing slurry as the conclusion of this research.