Proceedings of JSPE Semestrial Meeting
2006 JSPE Spring Meeting
Session ID : H23
Conference information

Host: The Japan Society for Precision Engineering

Relationship between plating conditions of diamond wire tool and slicing characteristics
Ken–ichi Ishikawa, Hitoshi Suwabe, *Yoshihiro Nakamura
Author information
Keywords: diamond, grain, slicing, wire tool, plating
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (131K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Abstract
[in Japanese]
Content from these authors
© 2006 The Japan Society for Precision Engineering
Previous article Next article
Favorites & Alerts

Recently viewed articles
Share this page
feedback
 Top