Effect of Thermal Deformation of Wire Guides and Ingot in Multi–wire Saw to Cutting Accuracy

Abstract

A warp and nanotopography accuracy in a wafer at the slicing process influences the wafer final quality, therefore, the improvement of slicing process has been investigated as an important problem. And it is necessary to solve the contradictory subject that lower cost and higher quality processing are performed rather than a former generationYprime;s small diameter wafer. This research is adding and estimating examination from mechanical factors, such as the machine static accuracy, thermal deformation, etc., for the purpose of developing high accuracy multi–wire saw which could respond to these demands. This report treats with the influence upon a thermal deformation of ingot and wire guides to processing accuracy, and describes the evaluated results.