Abstract
This report proposes a Micro–EDM method using different material combination electrodes, and shows a feasibility of this method by machining experiments. Different material combination electrodes consist of two parts, that is, an electrode part of silver thin film and a base part of silicon. Machining is conducted only with an Ag thin film electrode, while a Si base performs as a guide of a thin film electrode because Si is worn easily by heat generation due to its high resistance. In experiments, cemented carbide and silicon wafer were used as workpiece materials. Grooves machined with Ag electrodes were observed, and no affected area by a Si part was observed when Si with a specific resistance of 1 Ωcm was used for a base part. Affections of electrically conductive tape used for adhesion of Ag and Si were observed in machining cemented carbide, but weren″t observed in machining a Si wafer.
