The development of Electro Chemical Mechanical Polishing (ECMP) solution

Abstract

ECMP is thought to be one of the promising technologies for future planarization. Electrolyte takes an important role in the ECMP process. We developed electrolyte for the ECMP process, and clarified two points. One is that the combination of corrosion inhibitor and polymer is effective in pitting control. The second, planarization efficiency is affected by electrolyte's pH, because organic acid acting as complexing agent with copper has several dissociation states at different pH. One of the dissociation states inhibits the formation of protective layer, to which planarization efficiency is sensitive.