Proceedings of JSPE Semestrial Meeting
2007 JSPE Autumn Conference
Session ID : A66
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Through Hole Drilling of Glass Substrate with Electroplated Diamond Tool (1st Report)
Investigation of Drilling Conditions
*Akira MizobuchiHitoshi OgawaMasahiro Masuda
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
This report deals with drilling conditions to obtain smaller crack size when through-hole drilling soda-lime glass substrate of a thickness of 2.8mm using an electroplated diamond tool with a diameter of 1mm equipped chip pockets. The drilling conditions of a feed speed of 1mm/min and a mesh size of #600 bring out the crack size of 0.1mm or less. However, the size increases with drilling numbers due to the adhesion of chips.
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© 2007 The Japan Society for Precision Engineering
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