Evaluation for Spatial Wavelenght of Micro-Roughness Measuring Method Using Particle Diameter Measuring System by Light-Scattering Method

Abstract

A method for measuring of a micro-roughness on a silicon (Si) wafer surface has been developed by using the developed measuring system for nano-particles diameter by light scattering method. In this paper, evaluation for the detectable spatial wavelength characteristics is described on the measuring method for micro-roughness using the nano-particle system.