Through Hole Drilling of Glass plate with Electroplated Diamond Tool (2nd Report)

The effect of helical tool-path method on processing efficiency

Abstract

This paper deals with the effects of helical tool-path method on the processing efficiency and the crack size in through hole drilling of glass plate using an electroplated diamond tool. Compared with the step cycle drilling, the helical method is able to get not only the space for chip removed but also the continuous drilling process, and the drilling time was 1/10 or less. Drilling conditions and diamond grain sizes are investigated in order to control crack size at the hole exit when helical drilling the glass plate of 2.83mm thickness.