2008 JSPE Autumn Conference
Session ID : J67
Conference information
Host: The Japan Society for Precision Engineering
Improvement of the thickness distribution of AT cut quartz crystal wafer by open-air type plasma chemical vaporization machining
Improvement of processing accuracy by applying pulse modulation plasma
Keywords:
atmospheric pressure plasma,
plasma CVM,
quartz crystal wafer,
numerically controlled machining,
pulse modulation plasma
Details
