Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : C04
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Host: The Japan Society for Precision Engineering

Contact between Polishing Pad and Wafer in Chemical Mechanical Polishing.
*Nobutaka Sumomogi, Keiichi Kimura, Panart Khajornrungruang, Kazuki Ueno
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Keywords: CMP, Polishing Pad, Contact Area, Fluorescence Microscope
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[in Japanese]
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© 2008 The Japan Society for Precision Engineering
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