Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : C07
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Host: The Japan Society for Precision Engineering

Numerical Simulation on Slurry Flow and Heat Transfer between Wafer and Pad in CMP
*Takuo Toyofuku, Katsuya Nagayama, Keiichi Kimura, Kazuhiro Tanaka
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Keywords: Slurry Flow, CMP, Heat Transfer
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[in Japanese]
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© 2008 The Japan Society for Precision Engineering
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