New observation technique and applied research of surface roughness for silicon polishing pad

Correlation between thickness probability calculated from roughness carve and polishing behavior

Abstract

Ra, Rpk, and Rvk are adopted generally as reference index for surface roughness evaluation of Polishing pad. On the other hand, new technique has been reported to evaluate surface condition of CMP polishing pad circumstantially that calculate thickness probability from roughness carve. Surface condition of polishing pad is extremely important for Silicon polishing which is more mechanical process. This presentation is about introduction of new technology for Silicon polishing pad and correlation between the result and polishing itself.