Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : D15
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Host: The Japan Society for Precision Engineering

A Proposal of Abrasive-Free CMP Method of Cu Using Vacuum Ultra-Violet Light (2nd report)
Improvement of Polishing Efficiency
*Okiharu Kirino, Toshiyuki Enomoto
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Keywords: Polishing, CMP, Copper, VUV, Abrasive-Free
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[in Japanese]
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© 2008 The Japan Society for Precision Engineering
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