Proceedings of JSPE Semestrial Meeting
2008 JSPE Spring Conference
Session ID : A47
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Host: The Japan Society for Precision Engineering

Treatment of Silicon Wafer Edge by Ultrasonically Assisted Polishing
2nd Report: Effect of ultrasonic elliptic vibration on wafer edge surface quality
*Naoki Kobayashi, Yongbo Wu, Mitsuyoshi Nomura, Toshikatsu Sato, Weimin Lin
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Keywords: ultrasonic vibration polishing
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[in Japanese]
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© 2008 The Japan Society for Precision Engineering
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