Proceedings of JSPE Semestrial Meeting
2009 JSPE Spring Conference
Session ID : C34
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Through Hole Drilling of Glass plate with Electroplated Diamond Tool (3rd Report)
Behavior of grinding force in helical drilling
*Akira MizobuchiHitoshi OgawaMasahiro MasudaHiroaki Miwa
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Abstract
This paper deals with the effects of helical drilling on the processing efficiency and the crack size in through hole drilling of glass plate with a thickness of 2.83mm using an electroplated diamond tool. In helical drilling, a high feed rate can be adopted, but leads to the larger cracks at the hole exit owing to the larger grinding forces. Three components of grinding force are observed in order to find out drilling conditions satisfied the accuracy and the efficiency, which are investigated from the relationship between the direction of grinding forces and cracks.
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© 2009 The Japan Society for Precision Engineering
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