Proceedings of JSPE Semestrial Meeting
2009 JSPE Spring Conference
Session ID : D64
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Host: The Japan Society for Precision Engineering

Development of a water-seal-type porous chuck
*Atsunobu Une, Kenichiro Yoshitomi, Masaaki Mochida
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Keywords: pin chuck, porous chuck, CMP, water-seal-type chuck, ultrathin wafer, wafer warpage
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[in Japanese]
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© 2009 The Japan Society for Precision Engineering
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