The study about the transport phenomenon of slurry and heat on CMP

Abstract

CMP is a planarization technology of polishing chemical and mechanical action, and it is mainly used for the wafer for the main board of semi-conductor. The friction between wafer and pad generates the heat in CMP process, and it affects on polishing the wafer uniformly. In this study, we analyzed the transport of slurry and heat and we made the phenomenon clear.