Proceedings of JSPE Semestrial Meeting
2009 JSPE Spring Conference
Session ID : L75
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Host: The Japan Society for Precision Engineering

Internal crack propagation simulation in stealth dicing
*Kensuke Ogawa, Etsuji Ohmura, Masayoshi Kumagai, Makoto Nakano, Kenshi Fukumitsu, Yoshinori Hirata
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Keywords: laser material processing, dicing, silicon wafer, internal crack, simulation
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[in Japanese]
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© 2009 The Japan Society for Precision Engineering
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