Analysis of Natural Convection in Copper Deep Via Filling

Proceedings of JSPE Semestrial Meeting

2010 JSPE Autumn (Spring) Conference

Session ID : R36

DOI https://doi.org/10.11522/pscjspe.2010S.0.1129.0

Conference information

Host: The Japan Society for Precision Engineering

Analysis of Natural Convection in Copper Deep Via Filling

*Atsuyoshi Suzuki, Kiyonobu Aota, Naoki Mizukoshi, Masanori Hayase

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Keywords: electro deposition, copper, deep via, filling, centrifugal force, analysis

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

[in Japanese]

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© 2010 The Japan Society for Precision Engineering

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