Abstract
As information equipments such as laptop computers and cell phones are recently becoming thinner and smaller, the high-frequency quartz devices installed in these equipments are also needed to be extremely thin. Therefore, the efficient thinning process of the quarts wafers is strongly being required. This paper aims at the development of a novel polishing technique suiting for the thinning process of quartz wafers not only with high surface quality but also with processing efficiency compared with the conventional method. For this purpose, a semi-bonded abrasive tool produced by putting a Magnetic compound fluid (MCF) onto the circumference surface of a ring-shaped permanent magnet has been proposed. In this report, the fundamental polishing characteristic are experimentally investigated in the polishing of quartz wafers. The results show that the material removal rate reached 0.3 μm/min without any surface damages such as cracks and pits.
