Proceedings of JSPE Semestrial Meeting
2012 JSPE Autumn Conference
Session ID : E08
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The heat-resistance property 2 of c-BN thin films.
*Masao NomaToshio TokoroMichiru YamashitaHidetaka ShimaMasato Sasase
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Our group is doing applied study of c-BN films. Applied to the die casting process, c-BN film must characteristics do not peel off by heat shock. This heat shock test repeat from 300°C to 700°C. The c-BN film without inter layer Ti film was not peeling by a heat-contrast shock test.
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© 2012 The Japan Society for Precision Engineering
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