2012 JSPE Autumn Conference
Session ID : A62
Conference information
Host: The Japan Society for Precision Engineering
[title in Japanese]
*Shinichi Iwamoto, Syuhei Kurokawa, Toshiro Doi, Michio Uneda, Osamu Ohnishi, Toshiyuki Suzuki, Yasuhiro Kawase, Ken Harada
Author information
Keywords:
Si,
TSV (Through Silicon Via),
CMP (Chemical Mechanical Polishing),
damaged layer,
BG (Back Grind)
Details
