Proceedings of JSPE Semestrial Meeting
2012 JSPE Autumn Conference
Session ID : A66
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Host: The Japan Society for Precision Engineering

High efficiency CMP using a slurry-flow-back tool (1st report)
Influence of polishing parameters on slurry flow
*Yosuke Hirai, Kenichiro Yoshitomi, Masaaki Mochida, Katsunori Takehana
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Keywords: CMP, polishing pad, planarization, removal rate, slurry flow, high efficiency polishing
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Abstract
[in Japanese]
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© 2012 The Japan Society for Precision Engineering
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