Study on highly efficiency polishing technique of sapphire wafer substrate using controlled under AC electric field

Abstract

Recently, the manufacturing process of LED devices which use single crystal sapphire substrate as a wafer for epitaxial growth. This material property has high hardness and excellent chemical stability. Therefore, a lot of time is spent for polishing processing. In this study, we propose using a new controlled abrasive polishing technique applied AC electric field for increasingly enhancement of removal rate.