Deformations of the MEMS-Viscosity Sensor with Dual-Spiral Configuration

Abstract

The vibrating MEMS-viscosity sensor with dual-spiral configuration has been developed. This sensor, passing completely through a silicon wafer using MEMS processing, was made by the spiral portions with a vibrating part and a sensing part. Because the deformations due to various motions by external loads, that are torsion and bending, are able to affect to reliability of this sensor, the influences by deformations in this sensor were clarified from the results of simulation using Finite Element Methods (FEM). The results were utilized for MEMS process of the MEMS-viscosity sensor.