Investigation of Micro-drilling Characteristics for SiC by Harmonics of YAG Laser

Abstract

Silicon carbide is expected as a material for power devices in the next generation. The superior processing technique is important in order to utilize the high potential of silicon carbide. The laser processing is useful method for micro-machining. However, it is reported that the laser induced plasma has a great influence on machining characteristics. Therefore, micro-machining characteristics of silicon carbide by the harmonic of Nd:YAG laser were experimentally investigated in the viewpoints of wavelength and the surrounding condition. Moreover, micro-machining characteristics of silicon carbide by the harmonics of Nd:YAG laser were discussed by the observation of the plasma on the specimen surface.