Proceedings of JSPE Semestrial Meeting
2012 JSPE Autumn Conference
Session ID : A86
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Host: The Japan Society for Precision Engineering

Study on material removal mechanism for SiO2-CMP
Quantitative Evaluation on Adsorption Phenomenon of Fine Particle
*Yuichi Takano, Keisuke Suzuki, Panart Khajornrungruang, Keiichi Kimura
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Keywords: CMP, slurry, adsorption
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[in Japanese]
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© 2012 The Japan Society for Precision Engineering
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