Proceedings of JSPE Semestrial Meeting
2012 JSPE Spring Conference
Session ID : N36
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Host: The Japan Society for Precision Engineering

Development of sealing technology for MEMS devices using bonding with hydrogen radical treated lead-free solder paste
*Hiromu Kawai, Eiji Higurashi, Tadatomo Suga, Sakie Okada
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Keywords: lead-free solder, hydrogen radical, screen print, sealing, MEMS
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[in Japanese]
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© 2012 The Japan Society for Precision Engineering
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